Cypress Computer Hardware CY7C1018DV33 User Manual

CY7C1018DV33  
1-Mbit (128K x 8) Static RAM  
Features  
Functional Description[1]  
• Pin- and function-compatible with CY7C1018CV33  
• High speed  
The CY7C1018DV33 is a high-performance CMOS static  
RAM organized as 131,072 words by 8 bits. Easy memory  
expansion is provided by an active LOW Chip Enable (CE), an  
active LOW Output Enable (OE), and tri-state drivers. This  
device has an automatic power-down feature that significantly  
reduces power consumption when deselected.  
— t = 10 ns  
AA  
• Low Active Power  
— I = 60 mA @ 10 ns  
CC  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. Data on the eight I/O  
• Low CMOS Standby Power  
— I  
= 3 mA  
SB2  
pins (I/O through I/O ) is then written into the location  
0
7
• 2.0V Data retention  
specified on the address pins (A through A ).  
0
16  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing Write  
Enable (WE) HIGH. Under these conditions, the contents of  
the memory location specified by the address pins will appear  
on the I/O pins.  
• Center power/ground pinout  
• Easy memory expansion with CE and OE options  
• Available in Pb-free 32-pin 300-Mil wide Molded SOJ  
The eight input/output pins (I/O through I/O ) are placed in a  
0
7
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), or during a write  
operation (CE LOW, and WE LOW).  
The CY7C1018DV33 is available in Pb-free 32-pin 300-Mil  
wide Molded SOJ.  
Logic Block Diagram  
Pin Configuration  
SOJ  
Top View  
A
A
1
A
A
32  
31  
30  
1
0
16  
2
3
4
5
6
15  
A
2
A
14  
A
13  
A
29  
28  
3
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
1
2
3
4
5
6
CE  
INPUTBUFFER  
OE  
I/O  
I/O  
27  
26  
I/O  
0
1
7
A
0
I/O  
V
7
8
9
10  
11  
12  
13  
6
A
1
25  
24  
23  
22  
21  
V
CC  
SS  
A
2
V
V
CC  
I/O  
SS  
A
3
128K × 8  
ARRAY  
I/O  
I/O  
A
2
3
4
5
4
A
5
I/O  
A
A
6
WE  
A
4
12  
A
7
A
11  
20  
19  
A
8
A
5
A
10  
14  
15  
16  
A
6
A
9
A
8
18  
17  
CE  
WE  
POWER  
DOWN  
COLUMN  
DECODER  
A
7
I/O  
7
OE  
Note  
Cypress Semiconductor Corporation  
Document #: 38-05465 Rev. *D  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised November 8, 2006  
 
CY7C1018DV33  
Capacitance[3]  
Parameter  
Description  
Input Capacitance  
Output Capacitance  
Test Conditions  
Max.  
Unit  
pF  
C
C
T = 25°C, f = 1 MHz, V = 3.3V  
8
8
IN  
A
CC  
pF  
OUT  
Thermal Resistance[3]  
400-Mil  
Wide SOJ  
Parameter  
Description  
Test Conditions  
Unit  
Θ
Θ
Thermal Resistance  
(Junction to Ambient)  
Still Air, soldered on a 3 × 4.5 inch,  
four-layer printed circuit board  
57.61  
40.53  
°C/W  
JA  
Thermal Resistance  
(Junction to Case)  
°C/W  
JC  
AC Test Loads and Waveforms[4]  
ALL INPUT PULSES  
3.0V  
Z = 50  
90%  
10%  
90%  
10%  
OUTPUT  
GND  
50  
30 pF*  
* CAPACITIVE LOAD CONSISTS  
OF ALL COMPONENTS OF THE  
TEST ENVIRONMENT  
1.5V  
Fall Time: 1 V/ns  
Rise Time: 1 V/ns  
(b)  
(a)  
High-Z characteristics:  
R 317Ω  
3.3V  
OUTPUT  
R2  
351Ω  
5 pF  
(c)  
Notes  
3. Tested initially and after any design or process changes that may affect these parameters.  
4. AC characteristics (except High-Z) are tested using the load conditions shown in Figure (a). High-Z characteristics are tested for all speeds using the test load  
shown in Figure (c).  
Document #: 38-05465 Rev. *D  
Page 3 of 9  
 
CY7C1018DV33  
[5]  
AC Switching CharacteristicsOver the Operating Range  
–10 (Industrial)  
Parameter  
Description  
Unit  
Min.  
Max.  
Read Cycle  
[6]  
t
V
(typical) to the first access  
100  
10  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
power  
CC  
t
t
t
t
t
t
t
t
t
t
t
Read Cycle Time  
RC  
Address to Data Valid  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low-Z  
10  
AA  
3
OHA  
ACE  
DOE  
LZOE  
HZOE  
LZCE  
HZCE  
10  
5
0
3
0
[7, 8]  
OE HIGH to High-Z  
5
5
[8]  
CE LOW to Low-Z  
[7, 8]  
CE HIGH to High-Z  
[9]  
CE LOW to Power-up  
PU  
[9]  
CE HIGH to Power-down  
10  
PD  
[10, 11]  
Write Cycle  
t
t
t
t
t
t
t
t
t
t
Write Cycle Time  
10  
8
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
WC  
CE LOW to Write End  
Address Set-up to Write End  
Address Hold from Write End  
Address Set-up to Write Start  
WE Pulse Width  
SCE  
AW  
8
0
HA  
0
SA  
7
PWE  
SD  
Data Set-up to Write End  
Data Hold from Write End  
5
0
HD  
[8]  
WE HIGH to Low-Z  
3
LZWE  
HZWE  
[7, 8]  
WE LOW to High-Z  
5
Notes  
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V.  
6.  
7.  
t
gives the minimum amount of time that the power supply should be at typical V values until the first memory access can be performed.  
POWER CC  
t
, t  
, and t  
are specified with a load capacitance of 5 pF as in (c) of AC Test Loads. Transition is measured when the outputs enter a high impedance state.  
HZOE HZCE  
HZWE  
8. At any given temperature and voltage condition, t  
is less than t  
, t  
is less than t  
, and t  
is less than t  
for any given device.  
HZCE  
LZCE HZOE  
LZOE  
HZWE  
LZWE  
9. This parameter is guaranteed by design and is not tested.  
10. The internal Write time of the memory is defined by the overlap of CE LOW and WE LOW. CE and WE must be LOW to initiate a Write, and the transition of any of these  
signals can terminate the Write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the Write.  
11. The minimum Write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of t  
and t  
.
SD  
HZWE  
Document #: 38-05465 Rev. *D  
Page 4 of 9  
 
CY7C1018DV33  
Data Retention Characteristics (Over the Operating Range)  
Parameter  
Description  
for Data Retention  
CC  
Conditions  
Min.  
Max.  
Unit  
V
V
V
2
DR  
I
Data Retention Current  
V
= V = 2.0V, CE > V – 0.3V,  
3
mA  
CCDR  
CC  
DR  
CC  
V
> V – 0.3V or V < 0.3V  
IN  
CC IN  
[3]  
t
t
Chip Deselect to Data Retention Time  
Operation Recovery Time  
0
ns  
ns  
CDR  
[12]  
R
t
RC  
Data Retention Waveform  
DATA RETENTION MODE  
DR > 2V  
3.0V  
3.0V  
V
V
CC  
t
t
R
CDR  
CE  
Switching Waveforms  
[13, 14]  
Read Cycle No. 1 (Address Transition Controlled)  
tRC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
[14, 15]  
Read Cycle No. 2 (OE Controlled)  
ADDRESS  
CE  
t
RC  
t
ACE  
OE  
t
HZOE  
t
DOE  
t
HZCE  
t
LZOE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
DATA VALID  
t
LZCE  
t
PD  
V
CC  
ICC  
t
PU  
SUPPLY  
CURRENT  
50%  
50%  
ISB  
Notes  
12. Full device operation requires linear V ramp from V to V  
> 50 µs or stable at V > 50 µs.  
CC(min.)  
CC  
DR  
CC(min.)  
13. Device is continuously selected. OE, CE = V .  
IL  
14. WE is HIGH for Read cycle.  
15. Address valid prior to or coincident with CE transition LOW.  
Document #: 38-05465 Rev. *D  
Page 5 of 9  
 
CY7C1018DV33  
Switching Waveforms (continued)  
[16, 17]  
Write Cycle No. 1 (CE Controlled)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
SA  
t
SCE  
t
t
HA  
AW  
t
PWE  
WE  
t
t
HD  
SD  
DATA I/O  
DATA VALID  
[16, 17]  
Write Cycle No. 2 (WE Controlled, OE HIGH During Write)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
OE  
t
t
SD  
HD  
DATA VALID  
IN  
DATA I/O  
NOTE 18  
t
HZOE  
Notes  
16. Data I/O is high impedance if OE = V  
.
IH  
17. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.  
18. During this period the I/Os are in the output state and input signals should not be applied.  
Document #: 38-05465 Rev. *D  
Page 6 of 9  
 
CY7C1018DV33  
Switching Waveforms (continued)  
[11, 17]  
Write Cycle No. 3 (WE Controlled, OE LOW)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
t
t
HD  
SD  
DATA I/O  
NOTE 18  
DATA VALID  
t
t
LZWE  
HZWE  
Truth Table  
CE  
H
L
OE  
WE  
X
I/O –I/O  
Mode  
Power  
Standby (I  
0
7
X
L
High-Z  
Power-down  
Read  
)
SB  
H
Data Out  
Data In  
High-Z  
Active (I  
Active (I  
Active (I  
)
CC  
L
X
H
L
Write  
)
CC  
L
H
Selected, Outputs Disabled  
)
CC  
Ordering Information  
Speed  
(ns)  
Package  
Diagram  
Operating  
Range  
Ordering Code  
Package Type  
10  
CY7C1018DV33-10VXI  
51-85041 32-pin (300-Mil) Molded SOJ (Pb-free)  
Industrial  
Please contact your local Cypress sales representative for availability of these parts.  
Document #: 38-05465 Rev. *D  
Page 7 of 9  
 
CY7C1018DV33  
Package Diagram  
Figure 1. 32-pin (300-Mil) Molded SOJ (51-85041)  
PIN 1 I.D  
MIN.  
MAX.  
DIMENSIONS IN INCHES  
0.330  
0.340  
0.292  
0.305  
LEAD COPLANARITY 0.004 MAX.  
0.810  
0.830  
*
0.128  
0.140  
0.006  
0.012  
*
0.026  
0.050  
0.260  
*
0.032  
0.025  
MIN.  
0.275  
TYP.  
0.014  
0.020  
51-85041-*A  
All product and company names mentioned in this document are the trademarks of their respective holders.  
Document #: 38-05465 Rev. *D  
Page 8 of 9  
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be  
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its  
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
 
CY7C1018DV33  
Document History Page  
Document Title: CY7C1018DV33, 1-Mbit (128K x 8) Static RAM  
Document Number: 38-05465  
Orig. of  
REV.  
ECN NO. Issue Date  
Description of Change  
Advance Information data sheet for C9 IPP  
Change  
**  
201560  
238471  
See ECN  
See ECN  
SWI  
*A  
RKF  
DC parameters modified as per EROS (Spec # 01-02165)  
Pb-free Offering in the Ordering Information  
*B  
262950  
See ECN  
RKF  
Added Data Retention Characteristics table  
Added T  
Spec in Switching Characteristics table  
power  
Shaded Ordering Information  
*C  
*D  
307598  
520647  
See ECN  
See ECN  
RKF  
VKN  
Reduced Speed bins to -8 and -10 ns  
Converted from Preliminary to Final  
Removed Commercial Operating range  
Removed 8 ns speed bin  
Added I values for the frequencies 83MHz, 66MHz and 40MHz  
CC  
Updated Thermal Resistance table  
Updated Ordering Information Table  
Changed Overshoot spec from V +2V to V +1V in footnote #2  
CC  
CC  
Document #: 38-05465 Rev. *D  
Page 9 of 9  
 

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