Philips Stereo Amplifier TDA1556Q User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA1556Q  
2 x 22 W stereo BTL differential  
amplifier with speaker protection  
and dynamic distortion detector  
July 1994  
Product specification  
File under Integrated Circuits, IC01  
 
Philips Semiconductors  
Product specification  
2 x 22 W stereo BTL differential amplifier  
with speaker protection and dynamic  
TDA1556Q  
V
P
5
13  
1
2
mute switch  
input 1A  
input 1B  
6
VA  
output 1A  
mute switch  
8
VA  
output 1B  
4
DDD  
14  
mute/stand-by  
stand-by  
switch  
stand-by  
reference  
voltage  
V
A
15  
LSP  
n.c.  
mute  
switch  
x1  
TDA1556Q  
9
16  
17  
mute switch  
input 2A  
input 2B  
10  
VA  
output 2A  
mute switch  
12  
VA  
output 2B  
3
n.c.  
11  
7
MLA383-2  
powerground  
Fig.1 Block diagram.  
3
July 1994  
 
Philips Semiconductors  
Product specification  
2 x 22 W stereo BTL differential amplifier  
with speaker protection and dynamic  
TDA1556Q  
PINNING  
SYMBOL  
IN1A  
PIN  
DESCRIPTION  
input signal 1A  
1
2
3
4
5
6
7
8
9
handbook, halfpage  
IN 1A  
IN 1B  
n.c.  
1
2
IN1B  
n.c.  
input signal 1B  
not connected  
3
DDD  
dynamic distortion detector  
positive supply voltage 1  
output signal 1A  
Vp1  
DDD  
4
OUT1A  
GND1  
OUT1B  
n.c.  
V
5
P1  
power ground 1  
OUT 1A  
6
output signal 1B  
GND 1  
OUT 1B  
n.c.  
7
not connected  
8
OUT2A  
GND2  
OUT2B  
VP2  
10 output signal 2A  
11 power ground 2  
9
TDA1556Q  
10  
OUT 2A  
12 output signal 2B  
13 positive supply voltage 2  
14 mute/stand-by switch  
15 loudspeaker protection  
16 input signal 2B  
GND 2 11  
M/SB  
LSP  
12  
OUT 2B  
V
13  
14  
P2  
IN2A  
IN2B  
M/SB  
17 input signal 2A  
LSP 15  
IN 2A 16  
IN 2B 17  
MLA381 - 1  
Fig.2 Pin configuration.  
THERMAL RESISTANCE  
output 1  
output 2  
THERMAL  
handbook, halfpage  
virtual  
junction  
SYMBOL  
PARAMETER  
RESISTANCE  
2.8  
K/W  
2.8  
K/W  
Rth j-a  
from junction to ambient  
in free air  
40 K/W  
Rth j-c  
from junction to case  
(see Figs 3 and 4)  
1.5 K/W  
0.1  
K/W  
MLA382  
case  
Fig.3 Thermal resistance.  
July 1994  
4
 
Philips Semiconductors  
Product specification  
2 x 22 W stereo BTL differential amplifier  
with speaker protection and dynamic  
TDA1556Q  
FUNCTIONAL DESCRIPTION  
Loudspeaker protection  
The TDA1556Q contains two identical amplifiers each with  
a fixed gain of 26 dB and differential input stages.  
The device can be used for bridge-tied-load applications.  
The circuit has the following features:  
Should a short circuit to ground occur, thereby forcing a  
DC voltage 1 V across the loudspeaker, a built-in  
protection circuit is activated to limit the DC voltage across  
the speaker to 1 V. The delay time of the protection  
circuit can be influenced by the external capacitor  
connected to pin 15.  
low stand-by current (< 100 µA)  
low mute/stand-by switching current (low cost supply  
switch)  
A dynamic distortion detector (DDD) is activated when  
clipping occurs at one or both output stages. Its  
information may be used to operate a sound processor or  
DC volume control to attenuate the input signal, thereby  
minimizing the distortion.  
mute facility  
LIMITING VALUES  
In accordance with the absolute maximum system (IEC 134)  
SYMBOL  
VP  
PARAMETER  
positive supply voltage  
CONDITION  
MIN.  
MAX.  
UNIT  
operating  
18  
V
V
V
non-operating  
30  
45  
during 50 ms (load  
dump protection);  
rise time 2.5 ms  
IOSM  
IORM  
Tstg  
Tvj  
non-repetitive peak output current  
repetitive peak output current  
storage temperature range  
virtual junction temperature  
AC and DC short-circuit safe voltage  
energy handling capability at outputs  
reverse polarity  
55  
6
A
A
4
+150  
+150  
18  
°C  
°C  
V
Vpsc  
VP = 0  
200  
6
mJ  
V
Vpr  
Ptot  
total power dissipation  
60  
W
DC CHARACTERISTICS  
VP = 14.4 V; Tamb = 25 °C; unless otherwise specified  
SYMBOL  
Supply  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VP  
IP  
positive supply voltage  
quiescent current  
note 1  
6.0  
14.4  
80  
18  
V
160  
mA  
V
VO  
Vos  
DC output voltage  
note 2  
6.9  
DC output offset voltage  
operating  
100  
mV  
Mute/stand-by  
VON  
switch-on voltage level  
8.5  
V
July 1994  
5
 
Philips Semiconductors  
Product specification  
2 x 22 W stereo BTL differential amplifier  
with speaker protection and dynamic  
TDA1556Q  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
MUTE CONDITION  
Vmute  
VO  
mute voltage  
3.3  
6.4  
V
output signal in mute position  
DC output offset voltage  
VI max = 1 V; f = 1 kHz  
2
mV  
mV  
Vos  
100  
STANDBY CONDITION  
Vsb  
Isb  
stand-by voltage  
0
25  
10  
2
V
DC standby current  
V14 < 0.5 V  
100  
500  
60  
-
µA  
µA  
µA  
mA  
0.5 V V14 2.0 V  
Isw  
switch-on current  
supply current  
IPSC  
short-circuit to ground;  
note 3  
Loudspeaker protection  
V6-8, 10-12 DC voltage across RL  
0.5  
1.0  
V
s
td  
delay time  
Protection active ( V4-6 or V7-9 1.0 V  
I15  
current information  
voltage information  
3.6  
25  
µA  
V
V15  
Protection inactive ( V6-8 and V10-12 0.1 V)  
V15 voltage information  
Notes to the characteristics  
0.3  
V
1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V  
2. At 18 V < VP < 30 V the DC output voltage VP/2  
3. Conditions: V14 = 0 V; short circuit to ground; switch V14 to MUTE or ON condition, rise time at V14 = 10 µs  
4. Frequency response externally fixed  
5. Ripple rejection measured at the output with a source-impedance of 0 (maximum ripple amplitude of 2 V) and a  
frequency between 100 Hz and 10 kHz  
6. Mismatching is given by the following equation:  
Z
i1 Z  
Zi  
=
=
i2 × 100°⁄  
--------------------  
Zi1  
°
Z
i3 Z  
Zi  
i4 × 100°⁄  
--------------------  
Zi3  
°
7. Noise measured in a bandwidth of 20 Hz to 20 kHz  
8. Noise output voltage independent of RS (VI = 0 V)  
9. Common mode rejection ratio measured at the output with both inputs tied together. VI(RMS) < 3.5 V;  
f = 100 Hz - 10 kHz  
July 1994  
6
 
Philips Semiconductors  
Product specification  
2 x 22 W stereo BTL differential amplifier  
with speaker protection and dynamic  
TDA1556Q  
AC CHARACTERISTICS  
Vp = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 °C; unless otherwise specified  
SYMBOL  
PO  
PARAMETER  
output power  
CONDITION  
THD = 0.5%  
MIN.  
15  
TYP.  
17  
MAX.  
UNIT  
W
THD = 10%  
20  
22  
12  
W
W
THD = 0.5%;  
VP = 13.2 V  
THD = 10%;  
VP = 13.2 V  
17  
W
THD  
B
total harmonic distortion  
power bandwidth  
PO = 1 W  
0.1  
%
THD = 0.5%;  
PO = 1 dB; with  
respect to 15 W  
20 to  
15000  
Hz  
fl  
low frequency roll-off  
1 dB; note 4  
1 dB  
20  
25  
25  
Hz  
fh  
high frequency roll-off  
kHz  
dB  
Gv  
closed loop voltage gain  
supply voltage ripple rejection  
26  
27  
SVRR  
note 5  
ON condition  
MUTE condition  
stand-by condition  
48  
48  
80  
100  
120  
4
150  
dB  
dB  
dB  
kΩ  
%
Zi  
Zi  
Vno  
input impedance  
input impedance  
noise output voltage  
note 6  
ON: Rs = 0 ; note 7  
ON: Rs = 10 k;  
note 7  
70  
100  
120  
µV  
µV  
MUTE: Rs = 10 k;  
notes 7 and 8  
60  
µV  
α
channel separation  
Rs = 10 kΩ  
40  
64  
72  
3.5  
1
dB  
dB  
dB  
%
Gv  
CMRR  
THD  
channel unbalance  
common mode rejection ratio  
total harmonic distortion  
note 9  
IDDD = 50 µA (peak)  
July 1994  
7
 
Philips Semiconductors  
Product specification  
2 x 22 W stereo BTL differential amplifier  
with speaker protection and dynamic  
TDA1556Q  
mute/stand-by  
V
DDD  
4
P
2200  
µF  
100  
nF  
14  
5
13  
1/2 R  
220 nF  
s
1
6
Z
Z
i1  
i2  
audio  
source  
R
load  
8
220 µF  
1/2 R  
s
2
9
n.c.  
V
ref  
15  
4.7  
µF  
n.c.  
3
TDA1556Q  
1/2 R  
220 nF  
s
16  
10  
Z
Z
i3  
audio  
source  
R
load  
i4  
12  
220 µF  
1/2 R  
s
17  
7
11  
MLA380-2  
Fig.4 Stereo BTL test diagram.  
8
July 1994  
 
Philips Semiconductors  
Product specification  
2 x 22 W stereo BTL differential amplifier  
with speaker protection and dynamic  
TDA1556Q  
PACKAGE OUTLINE  
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)  
SOT243-1  
non-concave  
D
h
x
D
E
h
view B: mounting base side  
d
A
2
B
j
E
A
L
3
L
Q
c
1
17  
e
e
m
v
M
w
M
1
Z
2
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
(1)  
(1)  
UNIT  
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0  
15.5 4.2 0.60 0.38 23.6 19.6  
12.2  
11.8  
3.4 12.4 2.4  
3.1 11.0 1.6  
2.00  
1.45  
2.1  
1.8  
6
mm  
10  
2.54 1.27 5.08  
0.8  
4.3  
0.4 0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-03-11  
SOT243-1  
July 1994  
9
 
Philips Semiconductors  
Product specification  
2 x 22 W stereo BTL differential amplifier  
with speaker protection and dynamic  
TDA1556Q  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
SOLDERING  
Introduction  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
July 1994  
10  
 

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