Philips Car Amplifier TDA8928J User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA8928J  
Power stage 2 x 10 or 1 x 20 W  
class-D audio amplifier  
Preliminary specification  
2004 May 05  
Supersedes data of 2004 Feb 04  
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
1
FEATURES  
3
GENERAL DESCRIPTION  
High efficiency (> 90 %)  
The TDA8928J is a switching power stage for a high  
efficiency class-D audio power amplifier system.  
Supply voltage from ±7.5 V to ±30 V  
Very low quiescent current  
High output power  
With this power stage a compact 2 × 10 W self oscillating  
digital amplifier system can be built, operating with high  
efficiency and very low dissipation. No heatsink is  
required. The system operates over a wide supply voltage  
range from ±7.5 V up to ±30 V and consumes a very low  
quiescent current.  
Diagnostic output  
Usable as a stereo Single-Ended (SE) amplifier  
Electrostatic discharge protection (pin to pin)  
No heatsink required.  
2
APPLICATIONS  
Television sets  
Home-sound sets  
Multimedia systems  
All mains fed audio systems.  
4
QUICK REFERENCE DATA  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
General  
VP  
Iq(tot)  
η
supply voltage  
total quiescent current  
efficiency  
±7.5  
±12.5 ±30  
V
no load connected; VP = ±12.5 V  
Po = 10 W; RL = 8 ; VP = ±12.5 V  
25  
90  
45  
mA  
%
Stereo single-ended configuration  
Po  
output power  
RL = 8 ; THD = 10 %; VP = ±12.5 V  
RL = 16 ; THD = 10 %; VP = ±12.5 V  
9
10  
5
W
W
5
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
TDA8928J  
DBS17P  
plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)  
SOT243-3  
SOT577-2  
TDA8928ST  
RDBS17P plastic rectangular DIL-bent-SIL power package; 17 leads (row  
spacing 2.54 mm)  
2004 May 05  
3
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
6
BLOCK DIAGRAM  
V
V
DD2  
13  
DD1  
5
TDA8928J  
6
BOOT1  
OUT1  
4
1
2
9
DRIVER  
HIGH  
EN1  
SW1  
CONTROL  
AND  
HANDSHAKE  
7
DRIVER  
LOW  
REL1  
STAB  
temp  
V
V
SS1  
TEMPERATURE SENSOR  
AND  
CURRENT PROTECTION  
3
DIAG  
current  
DD2  
15  
12  
POWERUP  
BOOT2  
OUT2  
14  
17  
16  
DRIVER  
HIGH  
EN2  
SW2  
CONTROL  
AND  
HANDSHAKE  
11  
DRIVER  
LOW  
REL2  
8
10  
MGX377  
V
V
SS2  
SS1  
Fig.1 Block diagram.  
2004 May 05  
4
 
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
7
PINNING  
SYMBOL  
PIN  
DESCRIPTION  
SW1  
REL1  
DIAG  
1
2
3
digital switch input; channel 1  
digital control output; channel 1  
handbook, halfpage  
SW1  
REL1  
DIAG  
EN1  
1
2
digital open-drain output for  
overtemperature and overcurrent  
report  
3
EN1  
4
5
6
7
8
9
digital enable input; channel 1  
positive power supply; channel 1  
bootstrap capacitor; channel 1  
PWM output; channel 1  
4
VDD1  
V
5
DD1  
BOOT1  
OUT1  
VSS1  
BOOT1  
OUT1  
6
7
negative power supply; channel 1  
V
8
STAB  
decoupling internal stabilizer for  
logic supply  
SS1  
STAB  
9
TDA8928J  
VSS2  
10  
11  
12  
13  
14  
15  
negative power supply; channel 2  
PWM output; channel 2  
V
10  
SS2  
OUT2  
BOOT2  
VDD2  
OUT2 11  
bootstrap capacitor; channel 2  
positive power supply; channel 2  
digital enable input; channel 2  
BOOT2 12  
V
13  
DD2  
EN2  
POWERUP  
enable input for switching on  
internal reference sources  
EN2 14  
POWERUP 15  
REL2 16  
REL2  
SW2  
16  
17  
digital control output; channel 2  
digital switch input; channel 2  
SW2 17  
MGX378  
Fig.2 Pin configuration.  
2004 May 05  
5
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
8
FUNCTIONAL DESCRIPTION  
8.2  
Protection  
The TDA8928J is a two-channel audio power amplifier  
system using class-D technology.  
Temperature and short-circuit protection sensors are  
included in the TDA8928J. The diagnostic output is pulled  
down to VSS in the event that the maximum current or  
maximum temperature is exceeded. The system shuts  
itself down when pin DIAG is connected to pins EN1 and  
EN2.  
The power stage TDA8928J is used for driving the  
loudspeaker load. It performs a level shift from the  
low-power digital PWM signal, at logic levels, to a  
high-power PWM signal that switches between the main  
supply lines. A 2nd-order low-pass filter converts the PWM  
signal into an analog audio signal across the loudspeaker.  
8.2.1  
MAXIMUM TEMPERATURE  
Pin DIAG becomes LOW if the junction temperature (Tj)  
exceeds 150 °C. Pin DIAG becomes HIGH again if Tj is  
dropped to approximately 130 °C, so there is a hysteresis  
of approximately 20 °C.  
8.1  
Power stage  
The power stage contains high-power DMOS switches,  
drivers, timing and handshaking between the power  
8.2.2  
MAXIMUM CURRENT  
The following functions are available:  
When the loudspeaker terminals are short-circuited this  
will be detected by the current protection. Pin DIAG  
becomes LOW if the output current exceeds the maximum  
output current of 2 A. Pin DIAG becomes HIGH again if the  
output current drops below 2 A. The output current is  
limited at the maximum current detection level when pin  
DIAG is connected to pins EN1 and EN2.  
Switch (pins SW1 and SW2): digital inputs; switching  
from VSS to VSS + 12 V and driving the power DMOS  
switches  
Release (pins REL1 and REL2): digital outputs;  
switching from VSS to VSS + 12 V; follow pin SW1 and  
SW2 with a small delay. Note: for self oscillating  
applications this pin is not used  
Power-up (pin POWERUP): must be connected to a  
continuous supply voltage of at least VSS + 5 V with  
respect to VSS  
Enable (pins EN1 and EN2): digital inputs; at a level of  
VSS the power DMOS switches are open and the PWM  
outputs are floating; at a level of VSS + 12 V the power  
stage is operational  
Diagnostics (pin DIAG): digital open-drain output; pulled  
down to VSS if the maximum temperature or maximum  
current is exceeded.  
2004 May 05  
6
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
9
LIMITING VALUES  
In accordance with the Absolute Maximum Rate System (IEC 60134).  
SYMBOL PARAMETER CONDITIONS  
VP supply voltage  
VP(sc)  
MIN.  
MAX.  
±30  
±30  
UNIT  
V
supply voltage for  
V
short-circuits across the load  
IORM  
repetitive peak current in  
output pins  
2
A
Tstg  
storage temperature  
55  
40  
+150  
+85  
°C  
°C  
°C  
Tamb  
Tvj  
ambient temperature  
virtual junction temperature  
150  
Vesd(HBM)  
electrostatic discharge voltage note 1  
(HBM)  
all pins with respect to VDD (class 1a) 500  
+500  
V
V
V
all pins with respect to VSS (class 1a) 1500  
+1500  
+1500  
all pins with respect to each other  
(class 1a)  
1500  
Vesd(MM)  
electrostatic discharge voltage note 2  
(MM)  
all pins with respect to VDD (class B)  
all pins with respect to VSS (class B)  
250  
250  
250  
+250  
+250  
+250  
V
V
V
all pins with respect to each other  
(class B)  
Notes  
1. Human Body Model (HBM); Rs = 1500 ; C = 100 pF.  
2. Machine Model (MM); Rs = 10 ; C = 200 pF; L = 0.75 µH.  
10 THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
in free air  
in free air  
VALUE  
UNIT  
Rth(j-a)  
Rth(j-c)  
thermal resistance from junction to ambient  
thermal resistance from junction to case  
40  
K/W  
K/W  
1.5  
11 QUALITY SPECIFICATION  
In accordance with “SNW-FQ611” if this device is used as an audio amplifier.  
2004 May 05  
7
 
   
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
12 DC CHARACTERISTICS  
VP = ±12.5 V; Tamb = 25 °C; measured in test diagram of Fig.4; unless otherwise specified.  
SYMBOL  
Supply  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VP  
supply voltage  
total quiescent current  
±7.5  
±12.5  
25  
±30  
45  
10  
V
Iq(tot)  
no load connected  
outputs floating  
mA  
mA  
5
Internal stabilizer logic supply (pin STAB)  
VO(STAB) stabilizer output voltage  
Switch inputs (pins SW1 and SW2)  
referenced to VSS  
11.7  
13  
14.3  
V
VIH  
VIL  
HIGH-level input voltage  
LOW-level input voltage  
referenced to VSS  
referenced to VSS  
10  
0
15  
2
V
V
Control outputs (pins REL1 and REL2)  
VOH  
VOL  
HIGH-level output voltage  
LOW-level output voltage  
referenced to VSS  
referenced to VSS  
10  
0
15  
2
V
V
Diagnostic output (pin DIAG, open-drain)  
VOL  
ILO  
LOW-level output voltage  
output leakage current  
IDIAG = 1 mA; note 1  
no error condition  
0
1.0  
50  
V
µA  
Enable inputs (pins EN1 and EN2)  
VIH  
HIGH-level input voltage  
LOW-level input voltage  
hysteresis voltage  
input current  
referenced to VSS  
referenced to VSS  
9
5
15  
V
VIL  
0
V
VEN(hys)  
II(EN)  
4
V
300  
µA  
Switching-on input (pin POWERUP)  
VPOWERUP  
II(POWERUP)  
operating voltage  
input current  
referenced to VSS  
VPOWERUP = 12 V  
5
100  
12  
V
170  
µA  
Temperature protection  
Tdiag  
Thys  
temperature activating diagnostic VDIAG = VDIAG(LOW)  
150  
20  
°C  
°C  
hysteresis on temperature  
diagnostic  
VDIAG = VDIAG(LOW)  
Current protection  
IO(ocpl)  
overcurrent protection level  
2.1  
A
Note  
1. Temperature sensor or maximum current sensor activated.  
2004 May 05  
8
 
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
13 AC CHARACTERISTICS  
VP = ±12.5 V; Tamb = 25 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
Single-ended application; note 1  
Po  
output power  
RL = 8 Ω  
THD = 0.5 %  
8
W
W
THD = 10 %  
RL = 16 Ω  
10  
THD = 0.5 %  
4
5
W
W
THD = 10 %  
THD  
total harmonic distortion  
efficiency endstage  
Po = 1 W; note 3  
fi = 1 kHz  
0.05  
0.2  
90  
0.1  
%
%
%
fi = 10 kHz  
η
Po = 2 × 10 W; fi = 1 kHz; note 4  
Notes  
1. VP = ±12.5 V; RL = 8 ; fi = 1 kHz; fosc = 310 kHz; Rs = 0.1 (series resistance of filter coil); Tamb = 25 °C;  
2. Indirectly measured; based on Rds(on) measurement.  
3. Total Harmonic Distortion (THD) is measured in a bandwidth of 22 Hz to 20 kHz (AES 17 brickwall filter). When  
distortion is measured using a low-order low-pass filter a significantly higher value will be found, due to the switching  
4. Efficiency for power stage.  
2004 May 05  
9
 
       
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
14 SWITCHING CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
PWM outputs (pins OUT1 and OUT2); see Fig.3  
tr  
rise time  
30  
ns  
ns  
ns  
ns  
tf  
fall time  
30  
tblank  
tPD  
blanking time  
propagation delay  
70  
from pin SW1 (SW2) to  
pin OUT1 (OUT2)  
200  
tW(min)  
Rds(on)  
minimum pulse width  
220  
0.2  
270  
0.4  
ns  
on-resistance of the output  
transistors  
1/f  
osc  
V
DD  
PWM  
output  
(V)  
0 V  
V
SS  
t
t
t
r
f
blank  
t
PD  
V
STAB  
V
SW  
(V)  
V
SS  
V
STAB  
V
REL  
(V)  
V
SS  
MGW145  
100 ns  
Fig.3 Timing diagram PWM output, switch and release signals.  
10  
2004 May 05  
 
 
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   h
V
V
5
DD2  
13  
DD1  
TDA8928J  
BOOT1  
6
7
12 kΩ  
EN1  
4
DRIVER  
HIGH  
15 nF  
CONTROL  
AND  
OUT1  
SW1  
1
HANDSHAKE  
REL1  
2
9
DRIVER  
LOW  
STAB  
DIAG  
V
V
OUT1  
temp  
V
V
SS1  
TEMPERATURE SENSOR  
AND  
3
2V  
P
current  
DD2  
12  
CURRENT PROTECTION  
POWERUP  
15  
BOOT2  
OUT2  
12 V  
EN2  
14  
17  
16  
DRIVER  
HIGH  
15 nF  
100  
nF  
CONTROL  
AND  
HANDSHAKE  
SW2  
11  
REL2  
DRIVER  
LOW  
V
V
OUT2  
V
V
V
V
8
10  
V
V
V
V
V
V
V
V
EN  
SW1  
REL1  
STAB  
SW2  
REL2  
DIAG  
V
SS1  
SS2  
12 V  
0
12 V  
0
MGX379  
Fig.4 Test diagram.  
 
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
15.1 SE application  
15.2 Package ground connection  
The heatsink of the TDA8928J is connected internally to VSS  
.
15.3 Output power  
The output power in SE self oscillating class-D applications can be estimated using the formula  
2
RL  
× V  
------------------------------------------------  
P
(RL + Rds(on) + Rs)  
Po(1%)  
=
----------------------------------------------------------------------  
2 × RL  
[VP]  
RL + Rds(on) + Rs  
The maximum current IO(max)  
=
should not exceed 2 A.  
-------------------------------------------  
Where:  
RL = load impedance  
Rs = series resistance of filter coil  
Po(1%) = output power just at clipping.  
The output power at THD = 10 %: Po(10%) = 1.25 × Po(1%)  
.
15.4 Reference design  
The reference design for a self oscillating class-D system for the TDA8928J is shown in Fig.5. The Printed-Circuit Board  
2004 May 05  
12  
 
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L1  
V
V
CON1  
supply  
DDP  
bead  
C3  
C1  
100 nF  
470 µF  
+14.5 V  
(35 V)  
1
2
3
C4  
C2  
100 nF  
470 µF  
14.5 V  
(35 V)  
L2  
SSP  
bead  
V
V
V
DDP  
DDP  
R1  
10 kΩ  
J1  
2
1
C28  
560 pF  
C39  
R32  
V
DDP  
R9  
C29  
560 pF  
R33  
3.9  
kΩ  
100 Ω  
2.2 nF  
470 µF  
C10  
220 nF  
C14  
22 µF (100 V)  
C5  
C7  
(35 V)  
R3  
R19  
5.6 Ω  
1 kΩ  
SSP  
1 kΩ  
STAB (U1,9)  
R26  
L3  
0 Ω  
C19  
V
SSP  
U2A  
LM393  
R11  
2 kΩ  
C16  
100 nF  
33 µH  
8
C34  
220 nF  
22 µF  
(100 V)  
2.2 nF  
C20  
2
3
C9  
220 nF  
C12  
15 nF  
LS1  
8 Ω  
C8  
1
C17  
C32  
470 nF  
R22  
22 Ω  
220 nF  
2.2 nF  
R5  
4
1
V
V
DD2  
V
DD1  
SSP  
OUT1  
100 nF  
C15  
5
13  
SW1  
1
7
J3  
2
C24  
1 µF  
V
DDP  
220 kΩ  
REL1  
R30  
R13  
15 kΩ  
2
BOOT1  
STAB  
6
9
V
DDP  
C40  
R7  
POWERUP  
DIAG  
15  
3
39 kΩ  
C27  
22 µF  
(100 V)  
R24  
In1  
In2  
47 nF 3.9 kΩ  
U1  
TDA8928J  
R15  
10 kΩ  
R10  
0 Ω  
C28  
100 nF  
J2  
22 µF (100 V)  
0 Ω  
S1  
power-ON  
2
1
EN1  
R14  
15 kΩ  
4
DZ1  
36 V  
V
V
SSP  
EN2  
14  
16  
17  
R31  
R28  
0 Ω  
R8  
C41  
BOOT2  
OUT2  
V
REL2  
SW2  
12  
11  
SSP  
Q1  
DDP  
C25  
1 µF  
39 kΩ  
BC848  
R25  
2 kΩ  
3.9 kΩ  
47 nF  
R29  
0 Ω  
8
10  
R6  
R16  
1 kΩ  
V
V
SS2  
L4  
SS1  
V
220 kΩ  
SSP  
Q2  
C38  
C37  
DZ2  
3.3 V  
R17  
5.6 kΩ  
33 µH  
BC856  
100 nF  
220 pF  
C21  
C35  
220 nF  
LS2  
8 Ω  
V
C13  
15 nF  
SSP  
U2B  
LM393  
V
SSP  
2.2 nF  
C22  
5
6
C6  
470 µF  
(35 V)  
7
R21  
5.6 Ω  
C33  
470 nF  
R23  
22 Ω  
C11  
220 nF  
R12  
2 kΩ  
2.2 nF  
R4  
V
V
DDP  
STAB (U1,9)  
C30  
560 pF  
1 kΩ  
R34  
3.9 kΩ  
C42  
R35  
C31  
560 pF  
2.2 nF 150 Ω  
R2  
10 kΩ  
SSP  
mgx380  
Fig.5 Single-ended self oscillating class-D system application diagram for TDA8928J.  
 
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
15.4.1 PRINTED-CIRCUIT BOARD  
The printed-circuit board dimensions are 8.636 × 5.842 cm; single-sided copper of 35 µm; silk screen on both sides;  
79 holes; 94 components (32 resistors and 41 capacitors).  
R24  
pin 1  
C10  
R26  
R30 C28  
R1 R11  
R32  
C24  
C25  
C8  
C9  
C45  
C36  
R33  
R34  
C34  
R35  
C26  
R19  
C26  
R21  
C31  
C11  
R12  
C16  
R22  
R2  
C30  
R15 C37  
R31  
R13  
R14  
U2  
R3  
R4  
C22  
C21  
R6  
R29  
C19  
C50  
R5  
C35  
R9  
Q1  
R28  
R7  
R17  
R10  
Q2  
R23  
C17  
C41  
C2  
C1  
R8  
R16  
C40  
OUT1  
OUT2  
C13  
+
− −  
+
IN2  
IN1  
22 V  
V
DD  
GND  
C38  
C12  
R25  
Bottom silk  
MDB615  
Fig.6 Printed-circuit board (bottom silk) layout for TDA8928J.  
Bottom copper  
MDB617  
Fig.7 Printed-circuit board (bottom copper) layout for TDA8928J.  
14  
2004 May 05  
 
   
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
TDA8928ST  
U1  
L3  
C5  
J2  
J1  
C27  
state of D art  
typ +/- 12.5 V  
2 x 10 W in 8 Ω  
single layer  
V
C7  
P
C6  
C4  
L4  
demo PCB v2r4  
RL 1 2003  
DZ1  
C14  
C15  
J3  
L1  
C3  
L2  
C33  
C32  
S1  
DZ2  
CO2  
CO1  
In2  
Con3  
Con2  
Con1  
Out1  
Out2  
power_on  
In1  
Top silk  
Fig.8 Printed-circuit board (top silk) layout for TDA8928ST.  
mgx381  
15.4.2 BILL OF MATERIALS  
COMPONENT  
DESCRIPTION  
TDA8928ST  
TYPE  
COMMENTS  
U1  
Philips Semiconductors,  
SOT577-2  
U2  
LM393AD  
National, SO8  
alternatives: TI  
semiconductors and On  
semiconductors  
DZ1  
DZ2  
Q1  
36 V Zener diode  
3.3 V Zener diode  
BC848 transistor  
BC856 transistor  
bead  
BZX-79C36V, DO-35  
BZX-79C3V3, DO-35  
NPN, SOT23  
used as jumper  
used as jumper, optional  
Q2  
PNP, SOT23  
L1, L2  
L3, L4  
S1  
Murata BL01RN1-A62  
Toko 11RHBP-330M ws  
used as jumper  
totally shielded  
optional  
33 µH coil  
power-on switch  
PCB switch, SACME  
09-03290-01  
Con1  
V
SS, GND, VDD connector  
Augat 5KEV-03  
optional  
optional  
optional  
Con2, Con3  
CO1, CO2  
J1, J2, J3  
Out2, Out1 connector  
In1, In2 connector  
wire  
Augat 5KEV-02  
Cinch Farnell 152-396  
Jumpers, D = 0.5 mm  
Capacitors  
C37  
220 pF, 50 V  
560 pF, 100 V  
SMD0805  
SMD0805  
C28, C29, C30,  
C31  
50 V is OK  
2004 May 05  
15  
 
   
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
COMPONENT  
DESCRIPTION  
2.2 nF, 50 V  
TYPE  
COMMENTS  
C19, C20, C21,  
C22, C39, C42  
SMD0805  
C12, C13  
C40, C41  
15 nF, 50 V  
47 nF, 50 V  
SMD0805  
SMD1206  
SMD0805  
C1, C2, C16, C17, 100 nF, 50 V  
C26, C38  
C8, C9, C10, C11, 220 nF, 50 V  
C34, C35  
SMD1206  
C8 to C11 used as jumper  
C32, C33  
C24, C25  
470 nF, 63 V  
1 µF, 16 V  
22 µF, 100 V  
MKT  
SMD1206  
1206 due to supply range  
63 V is OK  
C7, C14, C15,  
C27  
Panasonic NHG Series  
ECA1JHG220  
C3, C4, C5, C6  
470 µF, 35 V  
Panasonic M Series  
ECA1VM471  
C18, C23, C36  
these capacitors have been  
removed  
Resistors  
R10, R26, R28,  
R29  
0 Ω  
SMD1206  
SMD0805  
used as jumpers  
R24  
0 Ω  
short-circuited in a new  
printed-circuit board layout  
R19, R21  
R22, R23  
R35  
5.6 , 0.25 W  
22 , 1 W  
150 Ω  
100 Ω  
1 kΩ  
1 kΩ  
2 kΩ  
2 kΩ  
SMD1206  
SMD2512  
SMD1206  
SMD1206  
SMD1206  
SMD0805  
SMD1206  
SMD0805  
SMD0805  
SMD0805  
SMD0805  
SMD0805  
SMD0805  
SMD0805  
1206 due to dissipation  
2512 due to dissipation  
used as jumper  
R32  
used as jumper  
R9  
used as jumper  
R3, R4, R16  
R11, R12  
R25  
used as jumpers  
R7, R8, R33, R34 3.9 kΩ  
R17  
5.6 kΩ  
10 kΩ  
15 kΩ  
39 kΩ  
220 kΩ  
R1, R2, R15  
R13, R14  
R30, R31  
R5, R6  
R18, R20, R27  
these resistors have been  
removed  
2004 May 05  
16  
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
15.5 Curves measured in reference design  
MGX383  
MGX384  
2
2
10  
10  
handbook, halfpage  
THD + N  
(%)  
handbook, halfpage  
THD + N  
(%)  
10  
10  
1
(1)  
1
(1)  
(2)  
1  
1  
10  
10  
(2)  
(3)  
2  
2  
10  
10  
3  
3  
10  
10  
10  
2
3
4
5
2  
1  
2
10  
10  
10  
10  
10  
10  
1
10  
10  
f (Hz)  
P
(W)  
i
o
2 × 8 SE; VP = ±12.5 V.  
(1) 6 kHz.  
2 × 8 SE; VP = ±12.5 V.  
(1) Po = 10 W.  
(2) 1 kHz.  
(3) 100 Hz.  
(2) Po = 1 W.  
Fig.9 THD + N as function of output power.  
Fig.10 THD + N as function of frequency.  
MGX385  
MGX386  
0
100  
handbook, halfpage  
handbook, halfpage  
SVRR  
(dB)  
η
(%)  
10  
80  
20  
30  
40  
60  
40  
(1)  
(2)  
(3)  
(4)  
20  
0
50  
60  
2
3
4
5
0
2
4
6
8
10  
10  
10  
10  
10  
10  
f (Hz)  
i
P
(W)  
o
VP = ±12.5 V; Vripple(p-p) = 2 V.  
(1) Both supply lines in phase.  
(2) One supply line (VSS) rippled.  
(3) One supply line (VDD) rippled.  
(4) Both supply lines in antiphase.  
2 × 8 SE; VP = ±12.5 V; fi = 1 kHz.  
Fig.11 Efficiency as function of output power.  
Fig.12 SVRR as function of frequency.  
2004 May 05  
17  
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
MGX387  
MGX388  
100  
0
handbook, halfpage  
handbooαk, halfpage  
S/N  
cs  
(dB)  
(dB)  
80  
60  
40  
20  
0
20  
40  
60  
80  
(1)  
(2)  
100  
2  
1  
2
2
3
4
5
10  
10  
10  
1
10  
10  
10  
10  
10  
10  
f (Hz)  
P
(W)  
i
o
2 × 8 SE; VP = ±12.5 V.  
(1) Po = 1 W.  
(2)  
Po = 10 W.  
2 × 8 SE; VP = ±12.5 V.  
Fig.14 Channel separation as function of  
frequency.  
Fig.13 S/N as function of output power.  
MDB624  
MGX389  
35  
24  
handbook, halfpage  
G
handbook, halfpage  
P
o
(dB)  
(W)  
20  
30  
25  
20  
15  
16  
12  
(1)  
(2)  
8
10  
10  
4
10  
2
3
4
5
10  
10  
10  
10  
12  
14  
16  
18  
20  
f (Hz)  
i
V
(V)  
P
THD + N = 10 %; fi = 1 kHz.  
(1) 2 × 8 SE.  
(2) 2 × 16 SE.  
2 × 8 SE; VP = ±12.5 V; Vi = 100 mV.  
Fig.15 Gain as function of frequency.  
Fig.16 Output power as function of supply voltage.  
2004 May 05  
18  
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
16 PACKAGE OUTLINE  
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)  
SOT243-3  
non-concave  
x
D
h
D
E
h
view B: mounting base side  
A
2
d
B
j
E
A
L
3
L
c
2
v
M
Q
1
17  
e
e
m
w
M
1
Z
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
(1)  
(1)  
UNIT  
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0  
15.5 4.4 0.60 0.38 23.6 19.6  
12.2  
11.8  
3.4  
3.1  
8.4  
7.0  
2.4  
1.6  
2.00  
1.45  
2.1  
1.8  
6
mm  
10  
2.54 1.27 5.08  
0.6  
4.3  
0.25 0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-17  
03-03-12  
SOT243-3  
2004 May 05  
19  
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads  
(row spacing 2.54 mm)  
SOT577-2  
non-concave  
D
h
x
D
E
h
view B: mounting base side  
A
2
d
B
j
E
A
L
Q
c
e
2
1
Z
17  
w
e
M
1
M
v
L
1
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
(1)  
(1)  
UNIT  
A
A
b
c
D
d
D
E
e
e
1
e
E
h
j
L
L
Q
v
w
x
Z
2
p
h
2
1
4.6 0.75 0.48 24.0 20.0  
4.4 0.60 0.38 23.6 19.6  
12.2  
11.8  
3.4 3.75 3.75  
3.1 3.15 3.15  
2.00  
1.45  
2.1  
1.8  
6
mm  
10  
2.54 1.27 2.54  
13.5  
0.6  
0.4  
0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
01-01-05  
03-03-12  
SOT577-2  
2004 May 05  
20  
 
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
17 SOLDERING  
The total contact time of successive solder waves must not  
exceed 5 seconds.  
17.1 Introduction to soldering through-hole mount  
packages  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg(max)). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
This text gives a brief insight to wave, dip and manual  
soldering. A more in-depth account of soldering ICs can be  
found in our “Data Handbook IC26; Integrated Circuit  
Packages” (document order number 9398 652 90011).  
Wave soldering is the preferred method for mounting of  
through-hole mount IC packages on a printed-circuit  
board.  
17.3 Manual soldering  
Apply the soldering iron (24 V or less) to the lead(s) of the  
package, either below the seating plane or not more than  
2 mm above it. If the temperature of the soldering iron bit  
is less than 300 °C it may remain in contact for up to  
10 seconds. If the bit temperature is between  
17.2 Soldering by dipping or by solder wave  
Driven by legislation and environmental forces the  
worldwide use of lead-free solder pastes is increasing.  
Typical dwell time of the leads in the wave ranges from  
3 to 4 seconds at 250 °C or 265 °C, depending on solder  
material applied, SnPb or Pb-free respectively.  
300 and 400 °C, contact may be up to 5 seconds.  
17.4 Suitability of through-hole mount IC packages for dipping and wave soldering methods  
SOLDERING METHOD  
PACKAGE  
DIPPING  
WAVE  
CPGA, HCPGA  
suitable  
DBS, DIP, HDIP, RDBS, SDIP, SIL  
PMFP(2)  
suitable  
suitable(1)  
not suitable  
Notes  
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.  
2. For PMFP packages hot bar soldering or manual soldering is suitable.  
2004 May 05  
21  
 
   
Philips Semiconductors  
Preliminary specification  
Power stage 2 x 10 or 1 x 20 W class-D  
audio amplifier  
TDA8928J  
18 DATA SHEET STATUS  
DATA SHEET  
STATUS(1)  
PRODUCT  
STATUS(2)(3)  
LEVEL  
DEFINITION  
I
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
II  
Preliminary data Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Relevant changes will  
be communicated via a Customer Product/Process Change Notification  
(CPCN).  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
19 DEFINITIONS  
20 DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes in the products -  
including circuits, standard cells, and/or software -  
described or contained herein in order to improve design  
and/or performance. When the product is in full production  
(status ‘Production’), relevant changes will be  
Application information  
Applications that are  
communicated via a Customer Product/Process Change  
Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these  
products, conveys no licence or title under any patent,  
copyright, or mask work right to these products, and  
makes no representations or warranties that these  
products are free from patent, copyright, or mask work  
right infringement, unless otherwise specified.  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2004 May 05  
22  
 
     
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: [email protected].  
© Koninklijke Philips Electronics N.V. 2004  
SCA76  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
R30/02/pp23  
Date of release: 2004 May 05  
Document order number: 9397 750 13041  
 

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