This product complies with the RoHS Directive (EU 2002/95/EC).
Schottky Barrier Diodes (SBD)
MA3S795EG
Silicon epitaxial planar type
For switching
For wave detection
Package
Features
Code
High-density mounting is possible
SSMini3-F3
Pin Name
1:Anode 1
2:Anode 2
3: Cathode
Forward voltage VF , optimum for low voltage rectification:VF < 0.3 V
Optimum for high frequency rectification because of its short
reverse recovery time trr
Absolute Maximum Ratings Ta = 25°C
Parameter
Reverse voltage
Maximum peak reverse voltage
Symbol
VR
Rating
Unit
V
Marking Symbol: M3D
30
Internal Connection
VRM
30
30
V
3
Single
Forward current
IF
mA
mA
Double
Single
20
150
Peak forward current
IFM
Double
110
1
2
Junction temperature
Storage time
Tj
125
°C
Tstg
–55 to +125
°C
Electrical Characteristics Ta = 25°C±3°C
Parameter
Forward voltage
Symbol
VF1
VF2
IR
Conditions
Min
Typ
Max
0.3
1.0
30
Unit
IF = 1 mA
IF = 30 mA
VR = 30 V
V
Reverse current
mA
Terminal capacitance
Ct
VR = 1 V, f = 1 MHz
1.5
1.0
pF
IF = IR = 10 mA, Irr = 1 mA,
Reverse recovery time *
trr
ns
%
RL = 100 W
VIN = 3 V(peak) , f = 30 MHz
Detection efficiency
65
η
RL = 3.9 kW, CL = 10 pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage
of current from the operating equipment.
3. Absolute frequency of input and output is 2 GHz
4. : trr measurement circuit
*
Bias Application Unit (N-50BU)
Input Pulse
tp
Output Pulse
trr
tr
t
10%
IF
t
A
90%
VR
I
rr = 1 mA
tp = 2 µs
tr = 0.35 ns
δ = 0.05
I
I
F = 10 mA
R = 10 mA
L = 100 Ω
Pulse Generator
(PG-10N)
Rs = 50 Ω
Wave Form Analyzer
R
(SAS-8130)
Ri = 50 Ω
Publication date: October 2008
SKH00236AED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
MA3S795EG
SSMini3-F3
Unit: mm
1.60 +−00..0035
0.26 +−00..0025
3
1
2
0.13 +−00..0025
(0.50)
(0.50)
1.00 ±0.05
(5°)
SKH00236AED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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