Transistor
2SC5378
Silicon NPN epitaxial planer type
For low-voltage low-noise high-frequency oscillation
Unit: mm
2.1±0.1
Features
Low noise figure NF.
025
1.25±0.1
0.425
■
●
●
High gain.
●
High transition frequency fT.
3
●
S-Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing and the magazine
packing.
2
Absolute Maximum Ratings (Ta=25˚C)
■
Parameter
Symbol
VCBO
VCEO
VEO
IC
Rating
U
V
0.2±0.1
Collector to base voltage
Collector to emitter voltage
Emitter to base voltage
Collector current
15
V
1:Base
2:Emitter
3:Collector
2
80
V
EIAJ:SC–70
S–Mini Type Package
mA
mW
˚C
Collector power dissipation
Junction temperature
Storage temperature
C
150
Marking symbol : HT
Tj
150
tg
–55 ~
C
Elecricl Chcteristics (Ta=5˚C)
■
Parameter
ymol
ICBO
IEBO
Conditns
min
typ
max
1
Unit
µA
Colector cuf current
Emittecutoff c
Forward curren
Collector output ca
Transition frequency
Noise figure
VCB = 10V, IE = 0
VEB = 1V, IC = 0
CE = 5V, IC = 10mA
1
µA
*1
hFE
Cob
fT
V
80
200
1
VCB = 5V, IE = 0, f = 1MHz
0.6
7
pF
GHz
dB
VCE = 5V, IC = 10mA, f = 2GHz
VCE = 5V, IC = 3mA, f = 1GHz
VCE = 5V, IC = 10mA, f = 1GHz
NF
| S21e
1.6
11
2
2
Foward transfer gain
|
8.5
dB
*1
h
Rank classification
FE
Rank
hFE
Q
R
S
80 ~ 115
95 ~ 155
135 ~ 200
1
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipmentcombustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change ut noice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, herere, ask for the ost up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your reqrements.
(5) When designing your equipment, comply with the range of absolute amum rating and the guaraing conditions
(operating power supply voltage and operating environment etc.). Espcially, ease be careful noexcange of absolute
maximum rating on the transient state, such as power-on, power-off ad mode-switching. Othwe will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed vales, tanto the consideration of indence of break down and failure
mode, possible to occur to semiconductor products. Measures on stems such as redundat design, arresting the spread of fire
or preventing glitch are recommended in order to prevnt hysicy, fire, social dmages, fr example, by usig the products.
(6) Comply with the instructions for use in order to preent breakdown and chaacterists change due to extenal factors (ESD, EOS,
thermal stress and mechanical stress) at the of hdling, mounting or customerprocess. When using products for which
damp-proof packing is required, satisfy thions, such as shelf life nd the lapsed time since first opening the packages.
(7) This book may be not reprinted oprodued wether wholly or prtially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
|